Industry knowledge

The main performance requirements of the titanium sputtering target

Material: TA1, TA2, TC4 

Specifications: According to customer needs processing

Packaging: According to customer needs, wooden box packaging implementation of standards: GB, ASTM

Type: ╬▒ Titanium Alloy Grade: TA2 

Origin: Baoji 

Titanium content: 99.96%

 Impurity content: 0.04% 

The main performance requirements of the titanium sputtering target 


Purity is one of the main performance indicators of the target, because the purity of the target has a great influence on the properties of the film. However, in practical applications, the purity of the target requirements are not the same. For example, with the rapid development of the microelectronics industry, the wafer size from 6 ", 8" to 12 ", and the wiring width from 0.5um reduced to 0.25um, 0.18um or even 0.13um, 99.995% before the target purity Can meet the 0.35umIC process requirements, and the preparation of 0.18um lines on the target purity is required 99.999% or even 99.9999%.

Impurity content

The impurities in the target solids and the oxygen and moisture in the pores are the main source of contamination for the deposited film. Different requirements of the target for different impurity content requirements are also different. For example, the semiconductor industry with pure aluminum and aluminum alloy target, the alkali content and radioactive element content has special requirements.


In order to reduce the pores in the  titanium sputtering target solids and to improve the performance of the sputtered film, it is generally desirable for the target to have a higher density. The density of the target not only affects the sputtering rate, but also affects the electrical and optical properties of the film. The higher the target density, the better the performance of the film. In addition, increasing the density and strength of the target allows the target to better withstand the thermal stress during sputtering. Density is also one of the key performance indicators of the target.

Grain size and grain size distribution

Usually the target is a polycrystalline structure with a grain size in the order of microns to millimeters. For the same target, the sputtering rate of the target with a small grain size is faster than that of the target with a large grain size. The thickness distribution of the sputtering deposited thin film with a small grain size difference (uniform distribution) is more uniform